||The most standard type is suitable for tapes, but is also commonly used for labels.
||Little time-dependence of release properties.
||Easy release with acrylic solvent adhesives. High time-dependence of release properties.
|| Easiest release of all easy-release products.
||Easy release with PE laminate paper. Good slickness.
||Particularly good curability and pot life. The standard easy-release product.
||Tighter release than KS-776A, and no tape curling. Suitable for tapes.
||Tighter release than KS-776A. Not slick, and can be used to glue multiple layers.
||Has paintability not found in conventional release paper silicones.
||Cannot be used alone, but is highly effective for release-control.
||Good adhesion to aluminum foil, and to OPP, PET and PE films. Good residual adhesion. The standard product for film applications.
||This type has greater curability and adhesion than KS-774.
|Concentrated coating applications
||Low-viscosity version of KS-778.
||Low-viscosity version of KS-847T. Improved resistance to exposure. Superior curability.
|Emulsion type, general purpose
||Easy-release applications. Suitable for common labels.
||Medium-release applications. Suitable for tapes.
||Easy-release applications. Suitable for common labels. Particularly good low-speed releasability.
||Good residual adhesion.
|Non-solvent type, general purpose
||Easy release, for PE laminates.
||Good Slickness. Suitable for craft PE laminate paper.
||Easy-release applications. Suitable for common tapes and labels.
||Medium-release applications. Suitable for common tapes and labels.
||Tight-release applications. Little time-dependence.
||Tight-release applications. Release-control agent.
| Non-solvent type, UV-cure applications
||Exposure to UV light yields a release paper with easy release and good residual adhesion.
||Catalyst unnecessary. One-component type, partial coating is possible, mercapto-modified.
||Catalyst necessary. Fast curing. Acrylic type. Nitrogen gas required.
|UV-cure film applications
||Medium-release applications. Suitable for substrates with low heat-resistance.